List of printing parameters for each type of filament in 3D printing
Here is a list of the main filaments used in 3D printing with their recommended parameters. These values may vary depending on the manufacturer and the printer used.
1. PLA (Polylactic Acid)
✅ Easy to print, biodegradable, low distortion
🔴 Heat sensitivity and low chemical resistance
Nozzle temperature: 190-220°C
Bed temperature: 50-65°C (can be printed without heating bed)
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Print speed: 40-80 mm/s
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Cooling: 100% enabled
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Adhesion to the deck: Nozzle close to the deck, lacquer, blue tape, or BuildTak
2. ABS (Acrylonitrile Butadiene Styrene)
✅ Shock and heat resistant
🔴 Requires a heating plate, tends to warp, emits harmful fumes
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Nozzle temperature: 220-250°C
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Plate temperature: 90-110°C
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Print speed: 40-60 mm/s
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Cooling: Off or low (~20%)
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Adhesion to the deck: ABS juice, glue, BuildTak, edges or rafts to limit warping
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Closed enclosure recommended
3. PETG (Polyethylene Terephthalate Glycolized)
✅ Resistant, flexible, little warping, good adhesion
🔴 Tendency to stringing, less precise than PLA
Nozzle temperature: 220-250°C
Plate temperature: 70-90°C
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Print speed: 40-60 mm/s
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Cooling: Partially activated (20-50%)
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Adhesion to the deck: BuildTak, lacquer, PEI tape
4. TPU/TPE (Flexible filaments)
✅ Very flexible, good resistance to shock and wear
🔴 Difficult to print, direct extruders recommended
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Nozzle temperature: 200-230°C
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Plate temperature: 40-60°C
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Print speed: 20-40 mm/s (slow printing recommended)
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Cooling: On (~50%)
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Adhesion to the tray: Blue tape, BuildTak, lacquer
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Tip: Reduce shrinkage to avoid clogging
5. Nylon (Polyamide)
✅ Very strong, flexible and durable
🔴 Strong warping, requires a very hot, hygroscopic platform (absorbs humidity)
Nozzle temperature: 230-270°C
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Plate temperature: 80-110°C
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Print speed: 30-50 mm/s
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Cooling: Disabled
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Adhesion to the board: Glue stick, Kapton tape, BuildTak
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Storage: Store in an airtight bag with desiccants
6. PC (Polycarbonate)
✅ Extremely resistant to shock and heat
🔴 Very difficult to print, strong warping, requires a closed enclosure
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Nozzle temperature: 250-300°C
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Plate temperature: 100-120°C
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Print speed: 30-50 mm/s
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Cooling: Disabled
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Adhesion to the board: BuildTak, glue, Kapton tape
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Closed enclosure required
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7. PVA (PolyVinyl Alcohol – Soluble Carrier)
✅ Water soluble, ideal for supports
🔴 Hygroscopic, requires dry storage
Nozzle temperature: 180-220°C
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Plate temperature: 45-60°C
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Print speed: 20-40 mm/s
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Cooling: On (~50%)
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Adhesion to the tray: Lacquer, BuildTak
8. HIPS (High Impact Polystyrene – Soluble Limonene Support)
✅ Ideal for supports with ABS, dissolves in D-limonene
🔴 Requires a closed enclosure, emits toxic fumes
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Nozzle temperature: 220-240°C
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Plate temperature: 90-110°C
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Print speed: 40-60 mm/s
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Cooling: Disabled
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Adhesion to the plate: Kapton, ABS juice, BuildTak
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9. CF (Reinforced Carbon – PLA, PETG or Nylon with Carbon Fibers)
✅ Very rigid and resistant, ideal for mechanical parts
🔴 Can wear out the nozzle quickly, requires a hardened steel nozzle
Nozzle temperature: Depends on the base polymer (PLA/PETG/Nylon)
Plate temperature: 60-80°C
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Print speed: 40-60 mm/s
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Cooling: Partially activated
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Board membership: BuildTak, PEI
General tips:
Storage: Some filaments (Nylon, PVA, TPU) should be stored in a dry place, preferably with desiccant bags.
Retraction: Adapt the parameters according to the material to avoid stringing.
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Nozzle: Check nozzle compatibility (hardened steel recommended for abrasive filaments such as carbon).
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Testing and adjustments: Each printer and filament may have different tolerances, it is often necessary to test before obtaining the best result.