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List of printing parameters for each type of filament in 3D printing
Here is a list of the main filaments used in 3D printing with their recommended parameters. These values ​​may vary depending on the manufacturer and the printer used.

 

1. PLA (Polylactic Acid)
✅ Easy to print, biodegradable, low distortion
🔴 Heat sensitivity and low chemical resistance

Nozzle temperature: 190-220°C

Bed temperature: 50-65°C (can be printed without heating bed)

  • Print speed: 40-80 mm/s

  • Cooling: 100% enabled

  • Adhesion to the deck: Nozzle close to the deck, lacquer, blue tape, or BuildTak

 

2. ABS (Acrylonitrile Butadiene Styrene)
✅ Shock and heat resistant
🔴 Requires a heating plate, tends to warp, emits harmful fumes

  • Nozzle temperature: 220-250°C

  • Plate temperature: 90-110°C

  • Print speed: 40-60 mm/s

  • Cooling: Off or low (~20%)

  • Adhesion to the deck: ABS juice, glue, BuildTak, edges or rafts to limit warping

  • Closed enclosure recommended

3. PETG (Polyethylene Terephthalate Glycolized)
✅ Resistant, flexible, little warping, good adhesion
🔴 Tendency to stringing, less precise than PLA

Nozzle temperature: 220-250°C

Plate temperature: 70-90°C

  • Print speed: 40-60 mm/s

  • Cooling: Partially activated (20-50%)

  • Adhesion to the deck: BuildTak, lacquer, PEI tape

 

4. TPU/TPE (Flexible filaments)
✅ Very flexible, good resistance to shock and wear
🔴 Difficult to print, direct extruders recommended

  • Nozzle temperature: 200-230°C

  • Plate temperature: 40-60°C

  • Print speed: 20-40 mm/s (slow printing recommended)

  • Cooling: On (~50%)

  • Adhesion to the tray: Blue tape, BuildTak, lacquer

  • Tip: Reduce shrinkage to avoid clogging

 

5. Nylon (Polyamide)
✅ Very strong, flexible and durable
🔴 Strong warping, requires a very hot, hygroscopic platform (absorbs humidity)

Nozzle temperature: 230-270°C

  • Plate temperature: 80-110°C

  • Print speed: 30-50 mm/s

  • Cooling: Disabled

  • Adhesion to the board: Glue stick, Kapton tape, BuildTak

  • Storage: Store in an airtight bag with desiccants

 

6. PC (Polycarbonate)
✅ Extremely resistant to shock and heat
🔴 Very difficult to print, strong warping, requires a closed enclosure

  • Nozzle temperature: 250-300°C

  • Plate temperature: 100-120°C

  • Print speed: 30-50 mm/s

  • Cooling: Disabled

  • Adhesion to the board: BuildTak, glue, Kapton tape

  • Closed enclosure required


  • 7. PVA (PolyVinyl Alcohol – Soluble Carrier)

✅ Water soluble, ideal for supports
🔴 Hygroscopic, requires dry storage

Nozzle temperature: 180-220°C

  • Plate temperature: 45-60°C

  • Print speed: 20-40 mm/s

  • Cooling: On (~50%)

  • Adhesion to the tray: Lacquer, BuildTak

 

8. HIPS (High Impact Polystyrene – Soluble Limonene Support)
✅ Ideal for supports with ABS, dissolves in D-limonene
🔴 Requires a closed enclosure, emits toxic fumes

  • Nozzle temperature: 220-240°C

  • Plate temperature: 90-110°C

  • Print speed: 40-60 mm/s

  • Cooling: Disabled

  • Adhesion to the plate: Kapton, ABS juice, BuildTak


  • 9. CF (Reinforced Carbon – PLA, PETG or Nylon with Carbon Fibers)

✅ Very rigid and resistant, ideal for mechanical parts
🔴 Can wear out the nozzle quickly, requires a hardened steel nozzle

Nozzle temperature: Depends on the base polymer (PLA/PETG/Nylon)

Plate temperature: 60-80°C

  • Print speed: 40-60 mm/s

  • Cooling: Partially activated

  • Board membership: BuildTak, PEI

General tips:
Storage: Some filaments (Nylon, PVA, TPU) should be stored in a dry place, preferably with desiccant bags.

Retraction: Adapt the parameters according to the material to avoid stringing.

  • Nozzle: Check nozzle compatibility (hardened steel recommended for abrasive filaments such as carbon).

  • Testing and adjustments: Each printer and filament may have different tolerances, it is often necessary to test before obtaining the best result.

 
 
 
 
 
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